Yole Développement and CITC invite you to take part in two online forums covering Power Packaging.
Packaging technologies are expanding the boundaries of RF and Power applications
Challenges have emerged for both applications concerning the integration of devices and systems. To ensure these applications’ continued evolution and activity development, packaging is the strategic answer. With increased functionalities, companies must refine their ability to integrate more and more components on the same die while proposing an exceptionally reliable final product.
The 3 hours forum with related presentations from key players, aim to provide answers and solutions to issues companies are facing. Click here for more information.
Both forums are now available for registration. The forums are free, so please enjoy the quality presentations and share the information with your colleagues.